Tape-packed components: Strip-packed ICs, transistors, and terminals without vacuum packaging and whose production date exceeds one year must be baked at a temperature of 60☌ for 12 hours.Ģ. Then the main purpose of baking PCB and components is to dry the moisture-absorbing components, so as to avoid deformation during the furnace, oxidation of the pads/pins, and blistering and delamination of the board! So how should we set a reasonable baking temperature value? The following is an explanation for you to set different temperature parameter values for different component baking.ġ. As the temperature of the welding equipment continues to increase, water vapor cannot be emitted from the PCB or components, and PCB blistering, swelling, and board explosion are likely to occur. If we do not perform a drying process on the PCB or components, when the reflow soldering or wave soldering furnace is suddenly heated above 200 degree Celsius during the soldering process, the volume of water vapor will quickly expand due to the rise in temperature. Due to the storage under the condition of uncertain production time, it is easy for the materials themselves to absorb moisture. Before SMT patch processing, we often encounter the situation that the materials supplied by customers or the materials purchased by the company are not vacuum-packed.
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